On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Fan-out wafer-level packaging (FOWLP) is an interesting platform for Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS sensor packaging has some unique challenges, while some originate merely from the fabrication of redistribution layers (RDL). For instance, it is cruc...

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Bibliographic Details
Main Authors: Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F. Becker, Sven Rzepka, Martin Schneider-Ramelow
Format: Article
Language:English
Published: MDPI AG 2020-05-01
Series:Micromachines
Subjects:
microelectromechanical systems (MEMS) packaging
inkjet printing
redistribution layers
capacitive micromachined ultrasound transducers (CMUT)
fan-out wafer-level packaging (FOWLP)
Online Access:https://www.mdpi.com/2072-666X/11/6/564

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https://www.mdpi.com/2072-666X/11/6/564

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