Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling

Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling

The coupled thermo-mechanical field analysis of three-dimensional (3D) stacked integrated circuits (ICs) is evaluated by an efficient and accurate simulation strategy that combines equivalent homogenization modeling methodology and sub-modeling technique. The thermal field is first investigated usin...

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Bibliographic Details
Main Authors: Zhiqiang Cheng, Yingtao Ding, Ziyue Zhang, Mingrui Zhou, Zhiming Chen
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
Three-dimensional integrated circuits
coupled thermo-mechanical analysis
equivalent homogenization modeling
sub-modeling technique
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Online Access:https://ieeexplore.ieee.org/document/8960386/

Internet

https://ieeexplore.ieee.org/document/8960386/

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