The formation and growth of intermetallic compounds during interdiffusion of Al/Cu bimetals
The diffusion couple technology was used to study the formation and growth of intermetallic compounds (IMCs) of Al/Cu bimetals at the temperature range of 480-540 ^o C for 5-20 h. The interfacial microstructure formed during interdiffusion and the growth kinetics of IMCs are determined. The results...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2022-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/ac69b4 |