Modeling and Manufacturing AAO-Based Micropatterned Chip Inductors for GHz Applications
In this work, contrary to the conventional 3D model for wire-wound chip inductors, we present a novel design featuring a copper wire-wound chip inductor, where 4.5 turns of a 20-μm-thick copper wire is wound around the substrate at an optimized distance of 50 μm from the substrate edge using photoli...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Korean Institute of Electromagnetic Engineering and Science
2025-01-01
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| Series: | Journal of Electromagnetic Engineering and Science |
| Subjects: | |
| Online Access: | https://www.jees.kr/upload/pdf/jees-2025-1-r-260.pdf |