Motor Power Signal Analysis for End-Point Detection of Chemical Mechanical Planarization
In the integrated circuit (IC) manufacturing, in-situ end-point detection (EPD) is an important issue in the chemical mechanical planarization (CMP) process. In the paper, we chose the motor power signal of the polishing platen as the monitoring object. We then used the moving average method, which...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2017-06-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2072-666X/8/6/177 |