Radio Frequency Properties of a 3D Printed Klystron Circuit
The manufacturing of active RF devices like klystrons is dominated by expensive and time-consuming cycles of machining and brazing. In this article, we characterize the RF properties of X-band klystron cavities and an integrated circuit manufactured with a novel additive manufacturing process. Parts...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-02-01
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| Series: | Instruments |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2410-390X/8/1/9 |