Radio Frequency Properties of a 3D Printed Klystron Circuit

The manufacturing of active RF devices like klystrons is dominated by expensive and time-consuming cycles of machining and brazing. In this article, we characterize the RF properties of X-band klystron cavities and an integrated circuit manufactured with a novel additive manufacturing process. Parts...

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Main Authors: Charlotte Wehner, Bradley Shirley, Garrett Mathesen, Julian Merrick, Brandon Weatherford, Emilio Alessandro Nanni
Format: Article
Language:English
Published: MDPI AG 2024-02-01
Series:Instruments
Subjects:
Online Access:https://www.mdpi.com/2410-390X/8/1/9
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author Charlotte Wehner
Bradley Shirley
Garrett Mathesen
Julian Merrick
Brandon Weatherford
Emilio Alessandro Nanni
author_facet Charlotte Wehner
Bradley Shirley
Garrett Mathesen
Julian Merrick
Brandon Weatherford
Emilio Alessandro Nanni
author_sort Charlotte Wehner
collection DOAJ
description The manufacturing of active RF devices like klystrons is dominated by expensive and time-consuming cycles of machining and brazing. In this article, we characterize the RF properties of X-band klystron cavities and an integrated circuit manufactured with a novel additive manufacturing process. Parts are 3D printed in 316 L stainless steel with direct metal laser sintering, electroplated in copper, and brazed in one simple braze cycle. Stand-alone test cavities and integrated circuit cavities were measured throughout the manufacturing process. The un-tuned cavity frequency varies by less than 5% of the intended frequency, and Q factors reach above 1200. A tuning study was performed, and unoptimized tuning pins achieved a tuning range of 138 MHz without compromising Q. Klystron system performance was simulated with as-built cavity parameters and realistic tuning. Together, these results show promise that this process can be used to cheaply and quickly manufacture a new generation of highly integrated high power vacuum devices.
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spelling doaj.art-8aa28b0dbe0748d0a792e78e2b6533922024-03-27T13:47:23ZengMDPI AGInstruments2410-390X2024-02-0181910.3390/instruments8010009Radio Frequency Properties of a 3D Printed Klystron CircuitCharlotte Wehner0Bradley Shirley1Garrett Mathesen2Julian Merrick3Brandon Weatherford4Emilio Alessandro Nanni5Department of Electrical Engineering, Stanford University, 350 Jane Stanford Way, Stanford, CA 94305, USASLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025, USASLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025, USASLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025, USASLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025, USASLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025, USAThe manufacturing of active RF devices like klystrons is dominated by expensive and time-consuming cycles of machining and brazing. In this article, we characterize the RF properties of X-band klystron cavities and an integrated circuit manufactured with a novel additive manufacturing process. Parts are 3D printed in 316 L stainless steel with direct metal laser sintering, electroplated in copper, and brazed in one simple braze cycle. Stand-alone test cavities and integrated circuit cavities were measured throughout the manufacturing process. The un-tuned cavity frequency varies by less than 5% of the intended frequency, and Q factors reach above 1200. A tuning study was performed, and unoptimized tuning pins achieved a tuning range of 138 MHz without compromising Q. Klystron system performance was simulated with as-built cavity parameters and realistic tuning. Together, these results show promise that this process can be used to cheaply and quickly manufacture a new generation of highly integrated high power vacuum devices.https://www.mdpi.com/2410-390X/8/1/93D printingadditive manufacturingdirect metal laser sintering (DMLS)klystronX-band
spellingShingle Charlotte Wehner
Bradley Shirley
Garrett Mathesen
Julian Merrick
Brandon Weatherford
Emilio Alessandro Nanni
Radio Frequency Properties of a 3D Printed Klystron Circuit
Instruments
3D printing
additive manufacturing
direct metal laser sintering (DMLS)
klystron
X-band
title Radio Frequency Properties of a 3D Printed Klystron Circuit
title_full Radio Frequency Properties of a 3D Printed Klystron Circuit
title_fullStr Radio Frequency Properties of a 3D Printed Klystron Circuit
title_full_unstemmed Radio Frequency Properties of a 3D Printed Klystron Circuit
title_short Radio Frequency Properties of a 3D Printed Klystron Circuit
title_sort radio frequency properties of a 3d printed klystron circuit
topic 3D printing
additive manufacturing
direct metal laser sintering (DMLS)
klystron
X-band
url https://www.mdpi.com/2410-390X/8/1/9
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