Radio Frequency Properties of a 3D Printed Klystron Circuit
The manufacturing of active RF devices like klystrons is dominated by expensive and time-consuming cycles of machining and brazing. In this article, we characterize the RF properties of X-band klystron cavities and an integrated circuit manufactured with a novel additive manufacturing process. Parts...
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Format: | Article |
Language: | English |
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MDPI AG
2024-02-01
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Series: | Instruments |
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Online Access: | https://www.mdpi.com/2410-390X/8/1/9 |
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author | Charlotte Wehner Bradley Shirley Garrett Mathesen Julian Merrick Brandon Weatherford Emilio Alessandro Nanni |
author_facet | Charlotte Wehner Bradley Shirley Garrett Mathesen Julian Merrick Brandon Weatherford Emilio Alessandro Nanni |
author_sort | Charlotte Wehner |
collection | DOAJ |
description | The manufacturing of active RF devices like klystrons is dominated by expensive and time-consuming cycles of machining and brazing. In this article, we characterize the RF properties of X-band klystron cavities and an integrated circuit manufactured with a novel additive manufacturing process. Parts are 3D printed in 316 L stainless steel with direct metal laser sintering, electroplated in copper, and brazed in one simple braze cycle. Stand-alone test cavities and integrated circuit cavities were measured throughout the manufacturing process. The un-tuned cavity frequency varies by less than 5% of the intended frequency, and Q factors reach above 1200. A tuning study was performed, and unoptimized tuning pins achieved a tuning range of 138 MHz without compromising Q. Klystron system performance was simulated with as-built cavity parameters and realistic tuning. Together, these results show promise that this process can be used to cheaply and quickly manufacture a new generation of highly integrated high power vacuum devices. |
first_indexed | 2024-04-24T18:09:20Z |
format | Article |
id | doaj.art-8aa28b0dbe0748d0a792e78e2b653392 |
institution | Directory Open Access Journal |
issn | 2410-390X |
language | English |
last_indexed | 2024-04-24T18:09:20Z |
publishDate | 2024-02-01 |
publisher | MDPI AG |
record_format | Article |
series | Instruments |
spelling | doaj.art-8aa28b0dbe0748d0a792e78e2b6533922024-03-27T13:47:23ZengMDPI AGInstruments2410-390X2024-02-0181910.3390/instruments8010009Radio Frequency Properties of a 3D Printed Klystron CircuitCharlotte Wehner0Bradley Shirley1Garrett Mathesen2Julian Merrick3Brandon Weatherford4Emilio Alessandro Nanni5Department of Electrical Engineering, Stanford University, 350 Jane Stanford Way, Stanford, CA 94305, USASLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025, USASLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025, USASLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025, USASLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025, USASLAC National Accelerator Laboratory, 2575 Sand Hill Road, Menlo Park, CA 94025, USAThe manufacturing of active RF devices like klystrons is dominated by expensive and time-consuming cycles of machining and brazing. In this article, we characterize the RF properties of X-band klystron cavities and an integrated circuit manufactured with a novel additive manufacturing process. Parts are 3D printed in 316 L stainless steel with direct metal laser sintering, electroplated in copper, and brazed in one simple braze cycle. Stand-alone test cavities and integrated circuit cavities were measured throughout the manufacturing process. The un-tuned cavity frequency varies by less than 5% of the intended frequency, and Q factors reach above 1200. A tuning study was performed, and unoptimized tuning pins achieved a tuning range of 138 MHz without compromising Q. Klystron system performance was simulated with as-built cavity parameters and realistic tuning. Together, these results show promise that this process can be used to cheaply and quickly manufacture a new generation of highly integrated high power vacuum devices.https://www.mdpi.com/2410-390X/8/1/93D printingadditive manufacturingdirect metal laser sintering (DMLS)klystronX-band |
spellingShingle | Charlotte Wehner Bradley Shirley Garrett Mathesen Julian Merrick Brandon Weatherford Emilio Alessandro Nanni Radio Frequency Properties of a 3D Printed Klystron Circuit Instruments 3D printing additive manufacturing direct metal laser sintering (DMLS) klystron X-band |
title | Radio Frequency Properties of a 3D Printed Klystron Circuit |
title_full | Radio Frequency Properties of a 3D Printed Klystron Circuit |
title_fullStr | Radio Frequency Properties of a 3D Printed Klystron Circuit |
title_full_unstemmed | Radio Frequency Properties of a 3D Printed Klystron Circuit |
title_short | Radio Frequency Properties of a 3D Printed Klystron Circuit |
title_sort | radio frequency properties of a 3d printed klystron circuit |
topic | 3D printing additive manufacturing direct metal laser sintering (DMLS) klystron X-band |
url | https://www.mdpi.com/2410-390X/8/1/9 |
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