Modeling of grinding chip thickness distribution based on material removel mode in grinding of SiC ceramics

Modeling of grinding chip thickness distribution based on material removel mode in grinding of SiC ceramics

Grinding chip thickness is an important parameter to reflect the grinding efficiency and investigate the grinding mechanism. Modeling of the chip thickness is generally based on a certain stochastic distribution model, like Uniform, Gaussian or Rayleigh distribution. This paper is devoted to establi...

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Bibliographic Details
Main Authors: Chongjun WU, Wanjiao DONG, Lijian ZHU, Jian ZHANG, Lijun XU, Steven Y LIANG
Format: Article
Language:English
Published: The Japan Society of Mechanical Engineers 2020-03-01
Series:Journal of Advanced Mechanical Design, Systems, and Manufacturing
Subjects:
chip thickness
rayleigh distribution
brittle materials
ductile grinding
grid calculation technique
Online Access:https://www.jstage.jst.go.jp/article/jamdsm/14/1/14_2020jamdsm0018/_pdf/-char/en

Internet

https://www.jstage.jst.go.jp/article/jamdsm/14/1/14_2020jamdsm0018/_pdf/-char/en

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