Modeling of grinding chip thickness distribution based on material removel mode in grinding of SiC ceramics
Grinding chip thickness is an important parameter to reflect the grinding efficiency and investigate the grinding mechanism. Modeling of the chip thickness is generally based on a certain stochastic distribution model, like Uniform, Gaussian or Rayleigh distribution. This paper is devoted to establi...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Japan Society of Mechanical Engineers
2020-03-01
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| Series: | Journal of Advanced Mechanical Design, Systems, and Manufacturing |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/jamdsm/14/1/14_2020jamdsm0018/_pdf/-char/en |