The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder
As people enter the era of the IoT (Internet of Things), more and more microelectronic devices and flexible electronic devices have been developed and applied. A novel Bi–In–Sn–Zn quaternary solder system is presented, aiming at improving mechanical properties of low-melting solders for flexible ele...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424003107 |