The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder
As people enter the era of the IoT (Internet of Things), more and more microelectronic devices and flexible electronic devices have been developed and applied. A novel Bi–In–Sn–Zn quaternary solder system is presented, aiming at improving mechanical properties of low-melting solders for flexible ele...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-03-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424003107 |
| _version_ | 1797247883363221504 |
|---|---|
| author | Sunwu Xu Yifei Li Xinyi Jing Kyung-Wook Paik Peng He Shuye Zhang |
| author_facet | Sunwu Xu Yifei Li Xinyi Jing Kyung-Wook Paik Peng He Shuye Zhang |
| author_sort | Sunwu Xu |
| collection | DOAJ |
| description | As people enter the era of the IoT (Internet of Things), more and more microelectronic devices and flexible electronic devices have been developed and applied. A novel Bi–In–Sn–Zn quaternary solder system is presented, aiming at improving mechanical properties of low-melting solders for flexible electronics. The study examines the differences in the microstructure of the Sn–Bi–In ternary solders before and after the addition of the Zn element, furthermore, it analyzes the role of the Zn element in the Bi–In–Sn system. The results indicate that the Zn element partially exists in the form of a Zn phase, while the remaining portion dissolves in the eutectic structure of the Sn–Bi–In alloy. Moreover, a significantly higher amount of Zn is found to dissolve in the (In,Bi)Sn4 phase compared to the BiIn phase. The dissolved Zn element enhances the strength of the solder by increasing the lattice distortion in the (In,Bi)Sn4 phase and refining the grains of the Sn–Bi–In alloy. Subsequently, the 53Bi30In17Sn–Zn equilibrium phase diagram was obtained by CALPHAD (Calculation of Phase Diagrams) method based on thermodynamic calculation, providing new idea for the future research and development of solder used in the electronic packaging field. |
| first_indexed | 2024-03-08T04:50:47Z |
| format | Article |
| id | doaj.art-8b3e6d6731154d6986373a33ed6199bb |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-04-24T20:05:46Z |
| publishDate | 2024-03-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-8b3e6d6731154d6986373a33ed6199bb2024-03-24T06:58:00ZengElsevierJournal of Materials Research and Technology2238-78542024-03-012922722278The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solderSunwu Xu0Yifei Li1Xinyi Jing2Kyung-Wook Paik3Peng He4Shuye Zhang5State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, ChinaState Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, ChinaState Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, ChinaDepartment of materials science and engineering, KAIST, 291 Daehak-ro, Yuseong-gu, Daejeon 305-338, Republic of KoreaState Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China; Corresponding author.State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China; Chongqing Research Institute, Harbin Institute of Technology, Chongqing 401135 China; Corresponding author. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.As people enter the era of the IoT (Internet of Things), more and more microelectronic devices and flexible electronic devices have been developed and applied. A novel Bi–In–Sn–Zn quaternary solder system is presented, aiming at improving mechanical properties of low-melting solders for flexible electronics. The study examines the differences in the microstructure of the Sn–Bi–In ternary solders before and after the addition of the Zn element, furthermore, it analyzes the role of the Zn element in the Bi–In–Sn system. The results indicate that the Zn element partially exists in the form of a Zn phase, while the remaining portion dissolves in the eutectic structure of the Sn–Bi–In alloy. Moreover, a significantly higher amount of Zn is found to dissolve in the (In,Bi)Sn4 phase compared to the BiIn phase. The dissolved Zn element enhances the strength of the solder by increasing the lattice distortion in the (In,Bi)Sn4 phase and refining the grains of the Sn–Bi–In alloy. Subsequently, the 53Bi30In17Sn–Zn equilibrium phase diagram was obtained by CALPHAD (Calculation of Phase Diagrams) method based on thermodynamic calculation, providing new idea for the future research and development of solder used in the electronic packaging field.http://www.sciencedirect.com/science/article/pii/S2238785424003107Sn-Bi-In alloyLow-melting lead-free solderMicrostructureStrengthening |
| spellingShingle | Sunwu Xu Yifei Li Xinyi Jing Kyung-Wook Paik Peng He Shuye Zhang The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder Journal of Materials Research and Technology Sn-Bi-In alloy Low-melting lead-free solder Microstructure Strengthening |
| title | The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder |
| title_full | The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder |
| title_fullStr | The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder |
| title_full_unstemmed | The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder |
| title_short | The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder |
| title_sort | grain refinements effect of zn alloying on low temperature sn bi in lead free solder |
| topic | Sn-Bi-In alloy Low-melting lead-free solder Microstructure Strengthening |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424003107 |
| work_keys_str_mv | AT sunwuxu thegrainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT yifeili thegrainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT xinyijing thegrainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT kyungwookpaik thegrainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT penghe thegrainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT shuyezhang thegrainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT sunwuxu grainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT yifeili grainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT xinyijing grainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT kyungwookpaik grainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT penghe grainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder AT shuyezhang grainrefinementseffectofznalloyingonlowtemperaturesnbiinleadfreesolder |