High-Breakdown P-Channel GaN MOS-HFETs With Al<sub>2</sub>O<sub>3</sub>-Dielectric and Drain Field-Plate

This work reports record-high three-terminal on-state drain-source breakdown voltage <inline-formula> <tex-math notation="LaTeX">$(BV_{DS})$ </tex-math></inline-formula> of &#x2212;735 V in p-channel GaN metal-oxide-semiconductor heterostructure field-effect tra...

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Main Authors: Jian-Hong Ke, Ching-Sung Lee, Yu-Xuan Li, Wei-Chou Hsu
Format: Article
Language:English
Published: IEEE 2023-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10182302/
_version_ 1797770203494350848
author Jian-Hong Ke
Ching-Sung Lee
Yu-Xuan Li
Wei-Chou Hsu
author_facet Jian-Hong Ke
Ching-Sung Lee
Yu-Xuan Li
Wei-Chou Hsu
author_sort Jian-Hong Ke
collection DOAJ
description This work reports record-high three-terminal on-state drain-source breakdown voltage <inline-formula> <tex-math notation="LaTeX">$(BV_{DS})$ </tex-math></inline-formula> of &#x2212;735 V in p-channel GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOS-HFETs) with a drain field-plate (DFP). High-k and wide-gap Al2O3 was deposited as the gate oxide and surface passivation by using a non-vacuum ultrasonic spray pyrolysis deposition (USPD) technique. Good source/drain ohmic contacts were obtained by devising an Mg-doped p&#x002B;&#x002B;-GaN capper. Enhanced two-dimension hole gas (2DHG) characteristics and current densities have also been achieved by the devised p-GaN/GaN/AlN/Al0.3Ga0.7N heterostructure. The present p-channel GaN MOS-HFET design with (without) DFP has demonstrated superior on/off current ratio <inline-formula> <tex-math notation="LaTeX">$(I_{on}/I_{off}$ </tex-math></inline-formula>) of <inline-formula> <tex-math notation="LaTeX">$2\times 10^{6}$ </tex-math></inline-formula> (<inline-formula> <tex-math notation="LaTeX">$9.2\times10\,\,^{\mathrm{ 5}}$ </tex-math></inline-formula>), maximum drain-source current density <inline-formula> <tex-math notation="LaTeX">$(I_{DS, max})$ </tex-math></inline-formula> of &#x2212;9.5 (&#x2212;10.6) mA/mm at <inline-formula> <tex-math notation="LaTeX">$V_{DS}\,\,=$ </tex-math></inline-formula> 20 V, two-terminal off-state gate-drain breakdown voltage <inline-formula> <tex-math notation="LaTeX">$(BV_{GD})$ </tex-math></inline-formula> of 710 (520) V, and <inline-formula> <tex-math notation="LaTeX">$BV_{DS}$ </tex-math></inline-formula> of &#x2212;735 (&#x2212;545) V, respectively. The present design is suitable for applications in high-voltage complementary power-switching circuits of electric vehicle (EV) electronics.
first_indexed 2024-03-12T21:19:50Z
format Article
id doaj.art-8bf1891360e8421eb672a4748a8a7521
institution Directory Open Access Journal
issn 2168-6734
language English
last_indexed 2024-03-12T21:19:50Z
publishDate 2023-01-01
publisher IEEE
record_format Article
series IEEE Journal of the Electron Devices Society
spelling doaj.art-8bf1891360e8421eb672a4748a8a75212023-07-28T23:00:21ZengIEEEIEEE Journal of the Electron Devices Society2168-67342023-01-011142142510.1109/JEDS.2023.329491110182302High-Breakdown P-Channel GaN MOS-HFETs With Al<sub>2</sub>O<sub>3</sub>-Dielectric and Drain Field-PlateJian-Hong Ke0Ching-Sung Lee1https://orcid.org/0000-0002-3044-5073Yu-Xuan Li2Wei-Chou Hsu3Department of Electrical Engineering, National Cheng Kung University, Tainan City, TaiwanDepartment of Electronic Engineering, Feng Chia University, Taichung City, TaiwanDepartment of Electronic Engineering, Feng Chia University, Taichung City, TaiwanDepartment of Electrical Engineering, National Cheng Kung University, Tainan City, TaiwanThis work reports record-high three-terminal on-state drain-source breakdown voltage <inline-formula> <tex-math notation="LaTeX">$(BV_{DS})$ </tex-math></inline-formula> of &#x2212;735 V in p-channel GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOS-HFETs) with a drain field-plate (DFP). High-k and wide-gap Al2O3 was deposited as the gate oxide and surface passivation by using a non-vacuum ultrasonic spray pyrolysis deposition (USPD) technique. Good source/drain ohmic contacts were obtained by devising an Mg-doped p&#x002B;&#x002B;-GaN capper. Enhanced two-dimension hole gas (2DHG) characteristics and current densities have also been achieved by the devised p-GaN/GaN/AlN/Al0.3Ga0.7N heterostructure. The present p-channel GaN MOS-HFET design with (without) DFP has demonstrated superior on/off current ratio <inline-formula> <tex-math notation="LaTeX">$(I_{on}/I_{off}$ </tex-math></inline-formula>) of <inline-formula> <tex-math notation="LaTeX">$2\times 10^{6}$ </tex-math></inline-formula> (<inline-formula> <tex-math notation="LaTeX">$9.2\times10\,\,^{\mathrm{ 5}}$ </tex-math></inline-formula>), maximum drain-source current density <inline-formula> <tex-math notation="LaTeX">$(I_{DS, max})$ </tex-math></inline-formula> of &#x2212;9.5 (&#x2212;10.6) mA/mm at <inline-formula> <tex-math notation="LaTeX">$V_{DS}\,\,=$ </tex-math></inline-formula> 20 V, two-terminal off-state gate-drain breakdown voltage <inline-formula> <tex-math notation="LaTeX">$(BV_{GD})$ </tex-math></inline-formula> of 710 (520) V, and <inline-formula> <tex-math notation="LaTeX">$BV_{DS}$ </tex-math></inline-formula> of &#x2212;735 (&#x2212;545) V, respectively. The present design is suitable for applications in high-voltage complementary power-switching circuits of electric vehicle (EV) electronics.https://ieeexplore.ieee.org/document/10182302/P-channelGaNMOS-HFETnon-vacuum ultrasonic spray pyrolysis depositionAl₂O₃drain field-plate
spellingShingle Jian-Hong Ke
Ching-Sung Lee
Yu-Xuan Li
Wei-Chou Hsu
High-Breakdown P-Channel GaN MOS-HFETs With Al<sub>2</sub>O<sub>3</sub>-Dielectric and Drain Field-Plate
IEEE Journal of the Electron Devices Society
P-channel
GaN
MOS-HFET
non-vacuum ultrasonic spray pyrolysis deposition
Al₂O₃
drain field-plate
title High-Breakdown P-Channel GaN MOS-HFETs With Al<sub>2</sub>O<sub>3</sub>-Dielectric and Drain Field-Plate
title_full High-Breakdown P-Channel GaN MOS-HFETs With Al<sub>2</sub>O<sub>3</sub>-Dielectric and Drain Field-Plate
title_fullStr High-Breakdown P-Channel GaN MOS-HFETs With Al<sub>2</sub>O<sub>3</sub>-Dielectric and Drain Field-Plate
title_full_unstemmed High-Breakdown P-Channel GaN MOS-HFETs With Al<sub>2</sub>O<sub>3</sub>-Dielectric and Drain Field-Plate
title_short High-Breakdown P-Channel GaN MOS-HFETs With Al<sub>2</sub>O<sub>3</sub>-Dielectric and Drain Field-Plate
title_sort high breakdown p channel gan mos hfets with al sub 2 sub o sub 3 sub dielectric and drain field plate
topic P-channel
GaN
MOS-HFET
non-vacuum ultrasonic spray pyrolysis deposition
Al₂O₃
drain field-plate
url https://ieeexplore.ieee.org/document/10182302/
work_keys_str_mv AT jianhongke highbreakdownpchannelganmoshfetswithalsub2subosub3subdielectricanddrainfieldplate
AT chingsunglee highbreakdownpchannelganmoshfetswithalsub2subosub3subdielectricanddrainfieldplate
AT yuxuanli highbreakdownpchannelganmoshfetswithalsub2subosub3subdielectricanddrainfieldplate
AT weichouhsu highbreakdownpchannelganmoshfetswithalsub2subosub3subdielectricanddrainfieldplate