A design of the circle via in the millimeter CQFN package
This paper discussed a CQFN shell in 7 mm×7 mm×1.2 mm which was based on HTCC technology for the miniaturization needs of millimeter wave microwave device packaging. In order to solve the problem of electromagnetic leakage during high frequency signal transmission of ceramic shell, the shielding gro...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
National Computer System Engineering Research Institute of China
2023-02-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000159727 |