A design of the circle via in the millimeter CQFN package
This paper discussed a CQFN shell in 7 mm×7 mm×1.2 mm which was based on HTCC technology for the miniaturization needs of millimeter wave microwave device packaging. In order to solve the problem of electromagnetic leakage during high frequency signal transmission of ceramic shell, the shielding gro...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
National Computer System Engineering Research Institute of China
2023-02-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000159727 |
| Summary: | This paper discussed a CQFN shell in 7 mm×7 mm×1.2 mm which was based on HTCC technology for the miniaturization needs of millimeter wave microwave device packaging. In order to solve the problem of electromagnetic leakage during high frequency signal transmission of ceramic shell, the shielding ground hole is designed and optimized from different directions of signal transmission by using HFSS. Through simulation comparison, the shielding relationship between ground hole and electromagnetic signal in different areas is discussed and summarized. The results show that the RF pin could be used in the band from 0.1 GHz～40 GHz. The insertion loss of RF ports is less than 0.65 dB. The VSWR of the package is less than 1.50. |
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| ISSN: | 0258-7998 |