A design of the circle via in the millimeter CQFN package
This paper discussed a CQFN shell in 7 mm×7 mm×1.2 mm which was based on HTCC technology for the miniaturization needs of millimeter wave microwave device packaging. In order to solve the problem of electromagnetic leakage during high frequency signal transmission of ceramic shell, the shielding gro...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
National Computer System Engineering Research Institute of China
2023-02-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000159727 |
| _version_ | 1827630521445777408 |
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| author | Zhou Hao Yan Huizeng Shi Mengqiao Cheng Kai |
| author_facet | Zhou Hao Yan Huizeng Shi Mengqiao Cheng Kai |
| author_sort | Zhou Hao |
| collection | DOAJ |
| description | This paper discussed a CQFN shell in 7 mm×7 mm×1.2 mm which was based on HTCC technology for the miniaturization needs of millimeter wave microwave device packaging. In order to solve the problem of electromagnetic leakage during high frequency signal transmission of ceramic shell, the shielding ground hole is designed and optimized from different directions of signal transmission by using HFSS. Through simulation comparison, the shielding relationship between ground hole and electromagnetic signal in different areas is discussed and summarized. The results show that the RF pin could be used in the band from 0.1 GHz～40 GHz. The insertion loss of RF ports is less than 0.65 dB. The VSWR of the package is less than 1.50. |
| first_indexed | 2024-03-09T14:07:00Z |
| format | Article |
| id | doaj.art-8c082c2ddbd14a4ab459f298d926a239 |
| institution | Directory Open Access Journal |
| issn | 0258-7998 |
| language | zho |
| last_indexed | 2024-03-09T14:07:00Z |
| publishDate | 2023-02-01 |
| publisher | National Computer System Engineering Research Institute of China |
| record_format | Article |
| series | Dianzi Jishu Yingyong |
| spelling | doaj.art-8c082c2ddbd14a4ab459f298d926a2392023-11-30T03:40:55ZzhoNational Computer System Engineering Research Institute of ChinaDianzi Jishu Yingyong0258-79982023-02-0149211111410.16157/j.issn.0258-7998.2230093000159727A design of the circle via in the millimeter CQFN packageZhou Hao0Yan Huizeng1Shi Mengqiao2Cheng Kai3The 55 Research Institute of China Electronics Technology Group Corporation， Nanjing 210016， ChinaThe 55 Research Institute of China Electronics Technology Group Corporation， Nanjing 210016， ChinaThe 55 Research Institute of China Electronics Technology Group Corporation， Nanjing 210016， ChinaThe 55 Research Institute of China Electronics Technology Group Corporation， Nanjing 210016， ChinaThis paper discussed a CQFN shell in 7 mm×7 mm×1.2 mm which was based on HTCC technology for the miniaturization needs of millimeter wave microwave device packaging. In order to solve the problem of electromagnetic leakage during high frequency signal transmission of ceramic shell, the shielding ground hole is designed and optimized from different directions of signal transmission by using HFSS. Through simulation comparison, the shielding relationship between ground hole and electromagnetic signal in different areas is discussed and summarized. The results show that the RF pin could be used in the band from 0.1 GHz～40 GHz. The insertion loss of RF ports is less than 0.65 dB. The VSWR of the package is less than 1.50.http://www.chinaaet.com/article/3000159727cqfn40 ghzhtcc |
| spellingShingle | Zhou Hao Yan Huizeng Shi Mengqiao Cheng Kai A design of the circle via in the millimeter CQFN package Dianzi Jishu Yingyong cqfn 40 ghz htcc |
| title | A design of the circle via in the millimeter CQFN package |
| title_full | A design of the circle via in the millimeter CQFN package |
| title_fullStr | A design of the circle via in the millimeter CQFN package |
| title_full_unstemmed | A design of the circle via in the millimeter CQFN package |
| title_short | A design of the circle via in the millimeter CQFN package |
| title_sort | design of the circle via in the millimeter cqfn package |
| topic | cqfn 40 ghz htcc |
| url | http://www.chinaaet.com/article/3000159727 |
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