A Study on Laser-Assisted Cylindrical Grinding of Superhard Diamond Composite (DSiC) Materials: Surface Integrity and Efficiency
A novel laser-assisted cylindrical grinding process has been developed to enhance the machining of silicon-carbide-bonded diamond composites (DSiCs), critical for improving the performance and durability of components in subsea pump applications. DSiCs, containing approximately 50% diamond by volume...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-02-01
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| Series: | Journal of Manufacturing and Materials Processing |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2504-4494/9/2/56 |