Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions

With the rapid development of 5G, artificial intelligence (AI), and high-performance computing (HPC), there is a huge increase in the data exchanged between the processor and memory. However, the “storage wall” caused by the von Neumann architecture severely limits the computational performance of t...

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Bibliographic Details
Main Authors: Wenchao Tian, Bin Li, Zhao Li, Hao Cui, Jing Shi, Yongkun Wang, Jingrong Zhao
Format: Article
Language:English
Published: MDPI AG 2022-10-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/13/10/1790