Research on Defect Inspection Technology for Bump Height in Wafer-Level Packaging Based on the Triangulation Method
With the advent of the era of big data and the vigorous development of consumer electronics, the demand for higher-speed processing capacity for gigantic amounts of data is increasing; this requires finer and far more numerous connections between dies as an essential component for connection and ele...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-02-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/13/3/1997 |