Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste
Highly (111)-oriented nanotwinned copper (nt-Cu) and non-conductive paste (NCP) were employed to fabricate hybrid Cu–Cu bonding. We tailored and correlated the fracture modes, bonding strengths, and microstructures of the joints. A non-flow underfilling process was performed, and low temperature bon...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-05-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422003155 |