Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste
Highly (111)-oriented nanotwinned copper (nt-Cu) and non-conductive paste (NCP) were employed to fabricate hybrid Cu–Cu bonding. We tailored and correlated the fracture modes, bonding strengths, and microstructures of the joints. A non-flow underfilling process was performed, and low temperature bon...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-05-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422003155 |
| _version_ | 1828882850349318144 |
|---|---|
| author | Yu-Hao Kuo Dinh-Phuc Tran Jia-Juen Ong K.N. Tu Chih Chen |
| author_facet | Yu-Hao Kuo Dinh-Phuc Tran Jia-Juen Ong K.N. Tu Chih Chen |
| author_sort | Yu-Hao Kuo |
| collection | DOAJ |
| description | Highly (111)-oriented nanotwinned copper (nt-Cu) and non-conductive paste (NCP) were employed to fabricate hybrid Cu–Cu bonding. We tailored and correlated the fracture modes, bonding strengths, and microstructures of the joints. A non-flow underfilling process was performed, and low temperature bonding was achieved in a single heat treatment at 180 °C for 120 min without vacuum. We found that under a post-annealing treatment, recrystallization and grain growth occurred. The bonding interfaces were partially removed and the joints were further strengthened. The fracture modes of the hybrid bonding structure were characterized using pull tests and correlated with their bonding properties. Such hybrid Cu–Cu microbumps with high bonding strength and low thermal budget can be widely used for advanced ultra-fine-pitch packaging. |
| first_indexed | 2024-12-13T10:36:11Z |
| format | Article |
| id | doaj.art-8e4a3a390fe34b1b9e4d02bde79b9b44 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-12-13T10:36:11Z |
| publishDate | 2022-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-8e4a3a390fe34b1b9e4d02bde79b9b442022-12-21T23:50:43ZengElsevierJournal of Materials Research and Technology2238-78542022-05-0118859871Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive pasteYu-Hao Kuo0Dinh-Phuc Tran1Jia-Juen Ong2K.N. Tu3Chih Chen4Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, 30010, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, 30010, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, 30010, TaiwanDepartment of Materials Science and Engineering and Department of Electrical Engineering, City University of Hong Kong, Kowloon, Hong KongDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, 30010, Taiwan; Corresponding author.Highly (111)-oriented nanotwinned copper (nt-Cu) and non-conductive paste (NCP) were employed to fabricate hybrid Cu–Cu bonding. We tailored and correlated the fracture modes, bonding strengths, and microstructures of the joints. A non-flow underfilling process was performed, and low temperature bonding was achieved in a single heat treatment at 180 °C for 120 min without vacuum. We found that under a post-annealing treatment, recrystallization and grain growth occurred. The bonding interfaces were partially removed and the joints were further strengthened. The fracture modes of the hybrid bonding structure were characterized using pull tests and correlated with their bonding properties. Such hybrid Cu–Cu microbumps with high bonding strength and low thermal budget can be widely used for advanced ultra-fine-pitch packaging.http://www.sciencedirect.com/science/article/pii/S2238785422003155Nanotwinned CuHybrid bondingFracture modesGrain growth |
| spellingShingle | Yu-Hao Kuo Dinh-Phuc Tran Jia-Juen Ong K.N. Tu Chih Chen Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste Journal of Materials Research and Technology Nanotwinned Cu Hybrid bonding Fracture modes Grain growth |
| title | Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste |
| title_full | Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste |
| title_fullStr | Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste |
| title_full_unstemmed | Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste |
| title_short | Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste |
| title_sort | hybrid cu to cu bonding with nano twinned cu and non conductive paste |
| topic | Nanotwinned Cu Hybrid bonding Fracture modes Grain growth |
| url | http://www.sciencedirect.com/science/article/pii/S2238785422003155 |
| work_keys_str_mv | AT yuhaokuo hybridcutocubondingwithnanotwinnedcuandnonconductivepaste AT dinhphuctran hybridcutocubondingwithnanotwinnedcuandnonconductivepaste AT jiajuenong hybridcutocubondingwithnanotwinnedcuandnonconductivepaste AT kntu hybridcutocubondingwithnanotwinnedcuandnonconductivepaste AT chihchen hybridcutocubondingwithnanotwinnedcuandnonconductivepaste |