Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste
Highly (111)-oriented nanotwinned copper (nt-Cu) and non-conductive paste (NCP) were employed to fabricate hybrid Cu–Cu bonding. We tailored and correlated the fracture modes, bonding strengths, and microstructures of the joints. A non-flow underfilling process was performed, and low temperature bon...
Main Authors: | Yu-Hao Kuo, Dinh-Phuc Tran, Jia-Juen Ong, K.N. Tu, Chih Chen |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2022-05-01
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Series: | Journal of Materials Research and Technology |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422003155 |
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