Tunneling Atomic Layer-Deposited Aluminum Oxide: a Correlated Structural/Electrical Performance Study for the Surface Passivation of Silicon Junctions

Abstract Passivation is a key process for the optimization of silicon p-n junctions. Among the different technologies used to passivate the surface and contact interfaces, alumina is widely used. One key parameter is the thickness of the passivation layer that is commonly deposited using atomic laye...

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Main Authors: Kangping Liu, Odile Cristini-Robbe, Omar Ibrahim Elmi, Shuang Long Wang, Bin Wei, Ingsong Yu, Xavier Portier, Fabrice Gourbilleau, Didier Stiévenard, Tao Xu
Format: Article
Language:English
Published: SpringerOpen 2019-10-01
Series:Nanoscale Research Letters
Subjects:
Online Access:http://link.springer.com/article/10.1186/s11671-019-3160-2
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author Kangping Liu
Odile Cristini-Robbe
Omar Ibrahim Elmi
Shuang Long Wang
Bin Wei
Ingsong Yu
Xavier Portier
Fabrice Gourbilleau
Didier Stiévenard
Tao Xu
author_facet Kangping Liu
Odile Cristini-Robbe
Omar Ibrahim Elmi
Shuang Long Wang
Bin Wei
Ingsong Yu
Xavier Portier
Fabrice Gourbilleau
Didier Stiévenard
Tao Xu
author_sort Kangping Liu
collection DOAJ
description Abstract Passivation is a key process for the optimization of silicon p-n junctions. Among the different technologies used to passivate the surface and contact interfaces, alumina is widely used. One key parameter is the thickness of the passivation layer that is commonly deposited using atomic layer deposition (ALD) technique. This paper aims at presenting correlated structural/electrical studies for the passivation effect of alumina on Si junctions to obtain optimal thickness of alumina passivation layer. High-resolution transmission electron microscope (HRTEM) observations coupled with energy dispersive X-ray (EDX) measurements are used to determine the thickness of alumina at atomic scale. The correlated electrical parameters are measured with both solar simulator and Sinton’s Suns-Voc measurements. Finally, an optimum alumina thickness of 1.2 nm is thus evidenced.
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spelling doaj.art-8e7082a42d8c456aae0234a052efbd2f2023-09-03T01:32:57ZengSpringerOpenNanoscale Research Letters1931-75731556-276X2019-10-011411810.1186/s11671-019-3160-2Tunneling Atomic Layer-Deposited Aluminum Oxide: a Correlated Structural/Electrical Performance Study for the Surface Passivation of Silicon JunctionsKangping Liu0Odile Cristini-Robbe1Omar Ibrahim Elmi2Shuang Long Wang3Bin Wei4Ingsong Yu5Xavier Portier6Fabrice Gourbilleau7Didier Stiévenard8Tao Xu9Key Laboratory of Advanced Display and System Application, Shanghai UniversityPHLAM, UMR8523, Université de Lille 1Université de Djibouti, Groupe de Recherche PCM, Faculté des SciencesKey Laboratory of Advanced Display and System Application, Shanghai UniversityKey Laboratory of Advanced Display and System Application, Shanghai UniversityDepartment of Materials Science and Engineering, National Dong Hwa UniversityCIMAP, Normandie Univ, ENSICAEN, UNICAEN, CEA, CNRSCIMAP, Normandie Univ, ENSICAEN, UNICAEN, CEA, CNRSIEMN, UMR8520, Université de Lille 1Key Laboratory of Advanced Display and System Application, Shanghai UniversityAbstract Passivation is a key process for the optimization of silicon p-n junctions. Among the different technologies used to passivate the surface and contact interfaces, alumina is widely used. One key parameter is the thickness of the passivation layer that is commonly deposited using atomic layer deposition (ALD) technique. This paper aims at presenting correlated structural/electrical studies for the passivation effect of alumina on Si junctions to obtain optimal thickness of alumina passivation layer. High-resolution transmission electron microscope (HRTEM) observations coupled with energy dispersive X-ray (EDX) measurements are used to determine the thickness of alumina at atomic scale. The correlated electrical parameters are measured with both solar simulator and Sinton’s Suns-Voc measurements. Finally, an optimum alumina thickness of 1.2 nm is thus evidenced.http://link.springer.com/article/10.1186/s11671-019-3160-2Surface passivationAtomic layer depositionAlumina layerStructural/electrical propertiesSilicon p-n junction
spellingShingle Kangping Liu
Odile Cristini-Robbe
Omar Ibrahim Elmi
Shuang Long Wang
Bin Wei
Ingsong Yu
Xavier Portier
Fabrice Gourbilleau
Didier Stiévenard
Tao Xu
Tunneling Atomic Layer-Deposited Aluminum Oxide: a Correlated Structural/Electrical Performance Study for the Surface Passivation of Silicon Junctions
Nanoscale Research Letters
Surface passivation
Atomic layer deposition
Alumina layer
Structural/electrical properties
Silicon p-n junction
title Tunneling Atomic Layer-Deposited Aluminum Oxide: a Correlated Structural/Electrical Performance Study for the Surface Passivation of Silicon Junctions
title_full Tunneling Atomic Layer-Deposited Aluminum Oxide: a Correlated Structural/Electrical Performance Study for the Surface Passivation of Silicon Junctions
title_fullStr Tunneling Atomic Layer-Deposited Aluminum Oxide: a Correlated Structural/Electrical Performance Study for the Surface Passivation of Silicon Junctions
title_full_unstemmed Tunneling Atomic Layer-Deposited Aluminum Oxide: a Correlated Structural/Electrical Performance Study for the Surface Passivation of Silicon Junctions
title_short Tunneling Atomic Layer-Deposited Aluminum Oxide: a Correlated Structural/Electrical Performance Study for the Surface Passivation of Silicon Junctions
title_sort tunneling atomic layer deposited aluminum oxide a correlated structural electrical performance study for the surface passivation of silicon junctions
topic Surface passivation
Atomic layer deposition
Alumina layer
Structural/electrical properties
Silicon p-n junction
url http://link.springer.com/article/10.1186/s11671-019-3160-2
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