To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
We report here an approach to inhibit Cu–Sn intermetallic compounds (IMCs) in flip chip solder joints under thermal-gradient annealing. We reflowed two types of solders joints, Cu/SnAg/Cu and Cu/SnAg/Ni, in an oven (isothermal) and on a hot plate (with thermal-gradient) at 260 °C. During the isother...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423010530 |