Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times
This study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO<sub>2</sub>) and aluminium oxide (Al<sub>2</sub>O<sub>3</sub>) nanoparticles on the wettability performance of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of t...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-10-01
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Series: | Nanomaterials |
Subjects: | |
Online Access: | https://www.mdpi.com/2079-4991/13/20/2811 |