Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times
This study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO<sub>2</sub>) and aluminium oxide (Al<sub>2</sub>O<sub>3</sub>) nanoparticles on the wettability performance of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of t...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-10-01
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| Series: | Nanomaterials |
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| Online Access: | https://www.mdpi.com/2079-4991/13/20/2811 |
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| author | Nur Haslinda Mohamed Muzni Ervina Efzan Mhd Noor Mohd Mustafa Al Bakri Abdullah |
| author_facet | Nur Haslinda Mohamed Muzni Ervina Efzan Mhd Noor Mohd Mustafa Al Bakri Abdullah |
| author_sort | Nur Haslinda Mohamed Muzni |
| collection | DOAJ |
| description | This study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO<sub>2</sub>) and aluminium oxide (Al<sub>2</sub>O<sub>3</sub>) nanoparticles on the wettability performance of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of the SAC305 nanocomposite solder are comparable with thos of an SAC305 solder with a peak temperature window within a range of 240 to 250 °C. The wetting behaviour of the non-reinforced and reinforced SAC305 nanocomposite solder was determined and measured using the contact angle and spreading area and the relationships between them were studied. There is an increment in the spreading area (5.6 to 7.32 mm) by 30.71% and a reduction in the contact angle (26.3 to 18.6°) by 14.29% with an increasing reflow time up to 60 s when reinforcing SAC305 solder with 0.50 wt.% of TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> nanoparticles. The SAC305 nanocomposite solder has a better wetting performance compared with the SAC305 solder. As the reflow time increased, the spreading area increased and the contact angle decreased, which restricted intermetallic compound growth and thus improved wettability performance |
| first_indexed | 2024-03-10T20:59:45Z |
| format | Article |
| id | doaj.art-8eb40e608282458eaebed351c4d85919 |
| institution | Directory Open Access Journal |
| issn | 2079-4991 |
| language | English |
| last_indexed | 2024-03-10T20:59:45Z |
| publishDate | 2023-10-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Nanomaterials |
| spelling | doaj.art-8eb40e608282458eaebed351c4d859192023-11-19T17:36:30ZengMDPI AGNanomaterials2079-49912023-10-011320281110.3390/nano13202811Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow TimesNur Haslinda Mohamed Muzni0Ervina Efzan Mhd Noor1Mohd Mustafa Al Bakri Abdullah2Faculty of Engineering and Technology, Multimedia University, Ayer Keroh 75450, Malacca, MalaysiaFaculty of Engineering and Technology, Multimedia University, Ayer Keroh 75450, Malacca, MalaysiaFaculty of Chemical Engineering and Technology, Universiti Malaysia Perlis, Arau 02600, Perlis, MalaysiaThis study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO<sub>2</sub>) and aluminium oxide (Al<sub>2</sub>O<sub>3</sub>) nanoparticles on the wettability performance of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of the SAC305 nanocomposite solder are comparable with thos of an SAC305 solder with a peak temperature window within a range of 240 to 250 °C. The wetting behaviour of the non-reinforced and reinforced SAC305 nanocomposite solder was determined and measured using the contact angle and spreading area and the relationships between them were studied. There is an increment in the spreading area (5.6 to 7.32 mm) by 30.71% and a reduction in the contact angle (26.3 to 18.6°) by 14.29% with an increasing reflow time up to 60 s when reinforcing SAC305 solder with 0.50 wt.% of TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> nanoparticles. The SAC305 nanocomposite solder has a better wetting performance compared with the SAC305 solder. As the reflow time increased, the spreading area increased and the contact angle decreased, which restricted intermetallic compound growth and thus improved wettability performancehttps://www.mdpi.com/2079-4991/13/20/2811nanoparticleswettabilitynanocomposite |
| spellingShingle | Nur Haslinda Mohamed Muzni Ervina Efzan Mhd Noor Mohd Mustafa Al Bakri Abdullah Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times Nanomaterials nanoparticles wettability nanocomposite |
| title | Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times |
| title_full | Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times |
| title_fullStr | Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times |
| title_full_unstemmed | Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times |
| title_short | Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times |
| title_sort | wettability of sn 3 0ag 0 5cu solder reinforced with tio sub 2 sub and al sub 2 sub o sub 3 sub nanoparticles at different reflow times |
| topic | nanoparticles wettability nanocomposite |
| url | https://www.mdpi.com/2079-4991/13/20/2811 |
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