Effect of ultrasonic field on the mechanism of electrodeposited Cu nucleation and growth
Electrodeposition technology is widely used in the surface treatment of copper foil. The unique “mechanical disturbance effect” and “cavitation effect” of ultrasonic field can effectively control the electrodeposition process of Cu and improve the quality of electrodeposited layer. In this paper, Li...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423016939 |