Latest research progress of SiCp/Al composite for electronic packaging
With the rapid development, microelectronic technology has put forward strict requirements for electronic packaging materials (EPMs). SiCp/Al composites with high volume fraction of SiC has become an ideal candidate for EPMs due to their superior properties including high thermal conductivity, tailo...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2023-12-01
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| Series: | Reviews on Advanced Materials Science |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/rams-2023-0158 |