Latest research progress of SiCp/Al composite for electronic packaging
With the rapid development, microelectronic technology has put forward strict requirements for electronic packaging materials (EPMs). SiCp/Al composites with high volume fraction of SiC has become an ideal candidate for EPMs due to their superior properties including high thermal conductivity, tailo...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2023-12-01
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| Series: | Reviews on Advanced Materials Science |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/rams-2023-0158 |
| _version_ | 1797354369288503296 |
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| author | Yu Hong Jiaqin Liu Yucheng Wu |
| author_facet | Yu Hong Jiaqin Liu Yucheng Wu |
| author_sort | Yu Hong |
| collection | DOAJ |
| description | With the rapid development, microelectronic technology has put forward strict requirements for electronic packaging materials (EPMs). SiCp/Al composites with high volume fraction of SiC has become an ideal candidate for EPMs due to their superior properties including high thermal conductivity, tailorable coefficient of thermal expansion as well as low density in many fields. This study reviewed the manufacturing process of SiCp/Al composites in recent years. In addition, the interface between particle and matrix, the application, and the development trend of SiCp/Al composites has also been summarized. |
| first_indexed | 2024-03-08T13:49:25Z |
| format | Article |
| id | doaj.art-8ef1afbab40b4406b79129dc9b55b49c |
| institution | Directory Open Access Journal |
| issn | 1605-8127 |
| language | English |
| last_indexed | 2024-03-08T13:49:25Z |
| publishDate | 2023-12-01 |
| publisher | De Gruyter |
| record_format | Article |
| series | Reviews on Advanced Materials Science |
| spelling | doaj.art-8ef1afbab40b4406b79129dc9b55b49c2024-01-16T07:19:14ZengDe GruyterReviews on Advanced Materials Science1605-81272023-12-01621pp. 61510.1515/rams-2023-0158Latest research progress of SiCp/Al composite for electronic packagingYu Hong0Jiaqin Liu1Yucheng Wu2School of Materials Science and Engineering, Hefei University of Technology, Hefei, Anhui, 230009, ChinaLaboratory of Nonferrous Metal Material and Processing Engineering of Anhui Province, Institute of Industry & Equipment Technology, Hefei University of Technology, Hefei, Anhui, 230009, ChinaSchool of Materials Science and Engineering, Hefei University of Technology, Hefei, Anhui, 230009, ChinaWith the rapid development, microelectronic technology has put forward strict requirements for electronic packaging materials (EPMs). SiCp/Al composites with high volume fraction of SiC has become an ideal candidate for EPMs due to their superior properties including high thermal conductivity, tailorable coefficient of thermal expansion as well as low density in many fields. This study reviewed the manufacturing process of SiCp/Al composites in recent years. In addition, the interface between particle and matrix, the application, and the development trend of SiCp/Al composites has also been summarized.https://doi.org/10.1515/rams-2023-0158electronic packaging materialssicp/al compositesmanufacturing processinterfaceapplicationdevelopment trend |
| spellingShingle | Yu Hong Jiaqin Liu Yucheng Wu Latest research progress of SiCp/Al composite for electronic packaging Reviews on Advanced Materials Science electronic packaging materials sicp/al composites manufacturing process interface application development trend |
| title | Latest research progress of SiCp/Al composite for electronic packaging |
| title_full | Latest research progress of SiCp/Al composite for electronic packaging |
| title_fullStr | Latest research progress of SiCp/Al composite for electronic packaging |
| title_full_unstemmed | Latest research progress of SiCp/Al composite for electronic packaging |
| title_short | Latest research progress of SiCp/Al composite for electronic packaging |
| title_sort | latest research progress of sicp al composite for electronic packaging |
| topic | electronic packaging materials sicp/al composites manufacturing process interface application development trend |
| url | https://doi.org/10.1515/rams-2023-0158 |
| work_keys_str_mv | AT yuhong latestresearchprogressofsicpalcompositeforelectronicpackaging AT jiaqinliu latestresearchprogressofsicpalcompositeforelectronicpackaging AT yuchengwu latestresearchprogressofsicpalcompositeforelectronicpackaging |