Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows
Multiple reflow processes are utilized in complex electronic devices with multi-layered PCBs, stacked components, or 3D configurations to ensure reliable connections and minimize defects. A systematic analysis was performed to examine the influence of multiple reflow cycles on the microstructure and...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423022652 |