Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows
Multiple reflow processes are utilized in complex electronic devices with multi-layered PCBs, stacked components, or 3D configurations to ensure reliable connections and minimize defects. A systematic analysis was performed to examine the influence of multiple reflow cycles on the microstructure and...
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| Format: | Article |
| Language: | English |
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Elsevier
2023-09-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423022652 |
| _version_ | 1797646661954043904 |
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| author | M.S. Chang M.A.A. Mohd Salleh D.S.C. Halin F. Somidin H. Yasuda K. Nogita |
| author_facet | M.S. Chang M.A.A. Mohd Salleh D.S.C. Halin F. Somidin H. Yasuda K. Nogita |
| author_sort | M.S. Chang |
| collection | DOAJ |
| description | Multiple reflow processes are utilized in complex electronic devices with multi-layered PCBs, stacked components, or 3D configurations to ensure reliable connections and minimize defects. A systematic analysis was performed to examine the influence of multiple reflow cycles on the microstructure and interfacial reaction of In–35Sn microalloyed with 0.05 wt% Ni on a Cu substrate. The size of the primary IMC particles in the In–35Sn solder was observed during multiple reflow process on Cu using in-situ real-time synchrotron radiography imaging. Multiple reflow soldering caused the primary Cu(In,Sn)2 and interfacial Cu3(Sn,In) layer to coarsen. The Ni was present in the primary (Cu,Ni)1(In,Sn)2 particles and interfacial (Cu,Ni)3(Sn,In) layer and caused grain size refinement of the IMCs after multiple reflow soldering. The shear test showed that there was a minor increase in shear force after multiple reflows. However, the shear energy decreased, indicating a more notable decrease in displacement to fracture rather than shear force which suggests a higher tendency towards ductile fracture. |
| first_indexed | 2024-03-11T15:04:53Z |
| format | Article |
| id | doaj.art-8fd26764e5654ccd87e79591ce676fff |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-11T15:04:53Z |
| publishDate | 2023-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-8fd26764e5654ccd87e79591ce676fff2023-10-30T06:04:44ZengElsevierJournal of Materials Research and Technology2238-78542023-09-012686708687Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflowsM.S. Chang0M.A.A. Mohd Salleh1D.S.C. Halin2F. Somidin3H. Yasuda4K. Nogita5Centre of Excellence Geopolymer & Green Technology (CeGeoGTech), Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600, Jejawi, Arau, Perlis, MalaysiaCentre of Excellence Geopolymer & Green Technology (CeGeoGTech), Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600, Jejawi, Arau, Perlis, Malaysia; Corresponding author.Centre of Excellence Geopolymer & Green Technology (CeGeoGTech), Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600, Jejawi, Arau, Perlis, MalaysiaCentre of Excellence Geopolymer & Green Technology (CeGeoGTech), Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600, Jejawi, Arau, Perlis, MalaysiaDepartment of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto, 606-8501, JapanNihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland (UQ), Brisbane, QLD, 4072, AustraliaMultiple reflow processes are utilized in complex electronic devices with multi-layered PCBs, stacked components, or 3D configurations to ensure reliable connections and minimize defects. A systematic analysis was performed to examine the influence of multiple reflow cycles on the microstructure and interfacial reaction of In–35Sn microalloyed with 0.05 wt% Ni on a Cu substrate. The size of the primary IMC particles in the In–35Sn solder was observed during multiple reflow process on Cu using in-situ real-time synchrotron radiography imaging. Multiple reflow soldering caused the primary Cu(In,Sn)2 and interfacial Cu3(Sn,In) layer to coarsen. The Ni was present in the primary (Cu,Ni)1(In,Sn)2 particles and interfacial (Cu,Ni)3(Sn,In) layer and caused grain size refinement of the IMCs after multiple reflow soldering. The shear test showed that there was a minor increase in shear force after multiple reflows. However, the shear energy decreased, indicating a more notable decrease in displacement to fracture rather than shear force which suggests a higher tendency towards ductile fracture.http://www.sciencedirect.com/science/article/pii/S2238785423022652MicroalloyingIntermetallicMultiple reflowSynchrotron radiography |
| spellingShingle | M.S. Chang M.A.A. Mohd Salleh D.S.C. Halin F. Somidin H. Yasuda K. Nogita Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows Journal of Materials Research and Technology Microalloying Intermetallic Multiple reflow Synchrotron radiography |
| title | Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows |
| title_full | Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows |
| title_fullStr | Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows |
| title_full_unstemmed | Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows |
| title_short | Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows |
| title_sort | contribution of ni microalloying to cu dissolution in in 35sn cu solder joints after multiple reflows |
| topic | Microalloying Intermetallic Multiple reflow Synchrotron radiography |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423022652 |
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