Low-Temperature and High-Speed Fabrication of Nanocrystalline Ge Films on Cu Substrates Using Sub-Torr-Pressure Plasma Sputtering

We fabricated nanocrystalline Ge films using radio-frequency (RF) magnetron plasma sputtering deposition under a high Ar-gas pressure. The Ge nanograins changed from amorphous to crystalline when the distance between the Ge sputtering target and the substrate was decreased to 5 mm and the RF input p...

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Main Authors: Giichiro Uchida, Kenta Nagai, Ayaka Wakana, Yumiko Ikebe
Format: Article
Language:English
Published: IEEE 2022-01-01
Series:IEEE Open Journal of Nanotechnology
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9946384/
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author Giichiro Uchida
Kenta Nagai
Ayaka Wakana
Yumiko Ikebe
author_facet Giichiro Uchida
Kenta Nagai
Ayaka Wakana
Yumiko Ikebe
author_sort Giichiro Uchida
collection DOAJ
description We fabricated nanocrystalline Ge films using radio-frequency (RF) magnetron plasma sputtering deposition under a high Ar-gas pressure. The Ge nanograins changed from amorphous to crystalline when the distance between the Ge sputtering target and the substrate was decreased to 5 mm and the RF input power was 11.8 W&#x002F;cm<sup>2</sup> (60 W), where the deposition rate was as high as 660 nm&#x002F;min. In addition, the size of the nanocrystalline grains increased from 100 to 307 nm when the RF input power for plasma production was increased from 11.8 W&#x002F;cm<sup>2</sup> (60 W) to 17.7 W&#x002F;cm<sup>2</sup> (90 W). In the developed narrow-gap plasma process at sub-Torr pressures, nanocrystalline Ge films were successfully fabricated on Cu substrates at low temperatures, without the substrate being heated. However, when annealing was conducted under an N<sub>2</sub> atmosphere, which is the conventional method to induce solid-phase crystallization, the amorphous Ge layer on a Cu substrate changed to a Cu<sub>3</sub>Ge crystal layer through interdiffusion of Ge and Cu atoms at 400&#x2013;500 &#x00B0;C.
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spelling doaj.art-8fe2579872d64889bbc1495e2118f6ab2022-12-22T04:41:32ZengIEEEIEEE Open Journal of Nanotechnology2644-12922022-01-01315315810.1109/OJNANO.2022.32214629946384Low-Temperature and High-Speed Fabrication of Nanocrystalline Ge Films on Cu Substrates Using Sub-Torr-Pressure Plasma SputteringGiichiro Uchida0https://orcid.org/0000-0002-0331-0472Kenta Nagai1Ayaka Wakana2Yumiko Ikebe3https://orcid.org/0000-0001-6611-6012Faculty of Science and Technology, Meijo University, Nagoya, JapanFaculty of Science and Technology, Meijo University, Nagoya, JapanFaculty of Science and Technology, Meijo University, Nagoya, JapanFaculty of Science and Technology, Meijo University, Nagoya, JapanWe fabricated nanocrystalline Ge films using radio-frequency (RF) magnetron plasma sputtering deposition under a high Ar-gas pressure. The Ge nanograins changed from amorphous to crystalline when the distance between the Ge sputtering target and the substrate was decreased to 5 mm and the RF input power was 11.8 W&#x002F;cm<sup>2</sup> (60 W), where the deposition rate was as high as 660 nm&#x002F;min. In addition, the size of the nanocrystalline grains increased from 100 to 307 nm when the RF input power for plasma production was increased from 11.8 W&#x002F;cm<sup>2</sup> (60 W) to 17.7 W&#x002F;cm<sup>2</sup> (90 W). In the developed narrow-gap plasma process at sub-Torr pressures, nanocrystalline Ge films were successfully fabricated on Cu substrates at low temperatures, without the substrate being heated. However, when annealing was conducted under an N<sub>2</sub> atmosphere, which is the conventional method to induce solid-phase crystallization, the amorphous Ge layer on a Cu substrate changed to a Cu<sub>3</sub>Ge crystal layer through interdiffusion of Ge and Cu atoms at 400&#x2013;500 &#x00B0;C.https://ieeexplore.ieee.org/document/9946384/Plasma applicationsplasma controlsemiconductor filmssputteringgermaniumgermanium alloys
spellingShingle Giichiro Uchida
Kenta Nagai
Ayaka Wakana
Yumiko Ikebe
Low-Temperature and High-Speed Fabrication of Nanocrystalline Ge Films on Cu Substrates Using Sub-Torr-Pressure Plasma Sputtering
IEEE Open Journal of Nanotechnology
Plasma applications
plasma control
semiconductor films
sputtering
germanium
germanium alloys
title Low-Temperature and High-Speed Fabrication of Nanocrystalline Ge Films on Cu Substrates Using Sub-Torr-Pressure Plasma Sputtering
title_full Low-Temperature and High-Speed Fabrication of Nanocrystalline Ge Films on Cu Substrates Using Sub-Torr-Pressure Plasma Sputtering
title_fullStr Low-Temperature and High-Speed Fabrication of Nanocrystalline Ge Films on Cu Substrates Using Sub-Torr-Pressure Plasma Sputtering
title_full_unstemmed Low-Temperature and High-Speed Fabrication of Nanocrystalline Ge Films on Cu Substrates Using Sub-Torr-Pressure Plasma Sputtering
title_short Low-Temperature and High-Speed Fabrication of Nanocrystalline Ge Films on Cu Substrates Using Sub-Torr-Pressure Plasma Sputtering
title_sort low temperature and high speed fabrication of nanocrystalline ge films on cu substrates using sub torr pressure plasma sputtering
topic Plasma applications
plasma control
semiconductor films
sputtering
germanium
germanium alloys
url https://ieeexplore.ieee.org/document/9946384/
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AT kentanagai lowtemperatureandhighspeedfabricationofnanocrystallinegefilmsoncusubstratesusingsubtorrpressureplasmasputtering
AT ayakawakana lowtemperatureandhighspeedfabricationofnanocrystallinegefilmsoncusubstratesusingsubtorrpressureplasmasputtering
AT yumikoikebe lowtemperatureandhighspeedfabricationofnanocrystallinegefilmsoncusubstratesusingsubtorrpressureplasmasputtering