Microstructures and Electrical Resistivity of Aluminum–Copper Joints
Using pulsed double electrode-gas metal arc welding, aluminum wires are joined to copper plates with fillers of different fractions of silicon. Two layers of different microstructures are formed near the Al-Cu interface: one consists of a hypoeutectic microstructure of α (Al) + Al<sub>2</su...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-08-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/13/8/1474 |