Microstructures and Electrical Resistivity of Aluminum–Copper Joints
Using pulsed double electrode-gas metal arc welding, aluminum wires are joined to copper plates with fillers of different fractions of silicon. Two layers of different microstructures are formed near the Al-Cu interface: one consists of a hypoeutectic microstructure of α (Al) + Al<sub>2</su...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-08-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/13/8/1474 |
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| author | Jinchang Guo Chunkai Li Jianxiao Bian Jianrui Zhang Baolong Geng |
| author_facet | Jinchang Guo Chunkai Li Jianxiao Bian Jianrui Zhang Baolong Geng |
| author_sort | Jinchang Guo |
| collection | DOAJ |
| description | Using pulsed double electrode-gas metal arc welding, aluminum wires are joined to copper plates with fillers of different fractions of silicon. Two layers of different microstructures are formed near the Al-Cu interface: one consists of a hypoeutectic microstructure of α (Al) + Al<sub>2</sub>Cu, and the other consists of an intermetallic compound (IMC) of Al<sub>2</sub>Cu. Increasing the heat input causes increases in the thicknesses of the IMC layer and the layer of the hypoeutectic microstructure. Si suppresses the growth of the IMC layer and assists the growth of the layer of the hypoeutectic microstructure. The effects of the interface microstructures and chemical compositions on the electric resistivity of the joints are analyzed. The electric resistivity of the joints increases with the increase in the thicknesses of the IMC layer and the layer of the hypoeutectic microstructure. The law of mixture is used to calculate the electric resistivity of the joints, which is in accordance with the experimental results. |
| first_indexed | 2024-03-10T23:44:45Z |
| format | Article |
| id | doaj.art-9013397979da47c1a5e7fc966671e50e |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-10T23:44:45Z |
| publishDate | 2023-08-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj.art-9013397979da47c1a5e7fc966671e50e2023-11-19T02:11:46ZengMDPI AGMetals2075-47012023-08-01138147410.3390/met13081474Microstructures and Electrical Resistivity of Aluminum–Copper JointsJinchang Guo0Chunkai Li1Jianxiao Bian2Jianrui Zhang3Baolong Geng4School of Intelligent Manufacturing, Longdong University, Qingyang 745000, ChinaState Key Laboratory of Advanced Processing and Recycling Non-Ferrous Metals, Lanzhou University of Technology, Lanzhou 730050, ChinaSchool of Intelligent Manufacturing, Longdong University, Qingyang 745000, ChinaSchool of Intelligent Manufacturing, Longdong University, Qingyang 745000, ChinaSchool of Intelligent Manufacturing, Longdong University, Qingyang 745000, ChinaUsing pulsed double electrode-gas metal arc welding, aluminum wires are joined to copper plates with fillers of different fractions of silicon. Two layers of different microstructures are formed near the Al-Cu interface: one consists of a hypoeutectic microstructure of α (Al) + Al<sub>2</sub>Cu, and the other consists of an intermetallic compound (IMC) of Al<sub>2</sub>Cu. Increasing the heat input causes increases in the thicknesses of the IMC layer and the layer of the hypoeutectic microstructure. Si suppresses the growth of the IMC layer and assists the growth of the layer of the hypoeutectic microstructure. The effects of the interface microstructures and chemical compositions on the electric resistivity of the joints are analyzed. The electric resistivity of the joints increases with the increase in the thicknesses of the IMC layer and the layer of the hypoeutectic microstructure. The law of mixture is used to calculate the electric resistivity of the joints, which is in accordance with the experimental results.https://www.mdpi.com/2075-4701/13/8/1474Al-Cu jointresistivity of jointsfusion weldingintermetallic compounds |
| spellingShingle | Jinchang Guo Chunkai Li Jianxiao Bian Jianrui Zhang Baolong Geng Microstructures and Electrical Resistivity of Aluminum–Copper Joints Metals Al-Cu joint resistivity of joints fusion welding intermetallic compounds |
| title | Microstructures and Electrical Resistivity of Aluminum–Copper Joints |
| title_full | Microstructures and Electrical Resistivity of Aluminum–Copper Joints |
| title_fullStr | Microstructures and Electrical Resistivity of Aluminum–Copper Joints |
| title_full_unstemmed | Microstructures and Electrical Resistivity of Aluminum–Copper Joints |
| title_short | Microstructures and Electrical Resistivity of Aluminum–Copper Joints |
| title_sort | microstructures and electrical resistivity of aluminum copper joints |
| topic | Al-Cu joint resistivity of joints fusion welding intermetallic compounds |
| url | https://www.mdpi.com/2075-4701/13/8/1474 |
| work_keys_str_mv | AT jinchangguo microstructuresandelectricalresistivityofaluminumcopperjoints AT chunkaili microstructuresandelectricalresistivityofaluminumcopperjoints AT jianxiaobian microstructuresandelectricalresistivityofaluminumcopperjoints AT jianruizhang microstructuresandelectricalresistivityofaluminumcopperjoints AT baolonggeng microstructuresandelectricalresistivityofaluminumcopperjoints |