3D-printed facet-attached microlenses for advanced photonic system assembly

3D-printed facet-attached microlenses for advanced photonic system assembly

Wafer-level mass production of photonic integrated circuits (PIC) has become a technological mainstay in the field of optics and photonics, enabling many novel and disrupting a wide range of existing applications. However, scalable photonic packaging and system assembly still represents a major chal...

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Bibliographic Details
Main Authors: Yilin Xu, Pascal Maier, Mareike Trappen, Philipp-Immanuel Dietrich, Matthias Blaicher, Rokas Jutas, Achim Weber, Torben Kind, Colin Dankwart, Jens Stephan, Andreas Steffan, Amin Abbasi, Padraic Morrissey, Kamil Gradkowski, Brian Kelly, Peter O’Brien, Wolfgang Freude, Christian Koos
Format: Article
Language:English
Published: Light Publishing Group 2023-01-01
Series:Light: Advanced Manufacturing
Subjects:
photonic integration
photonic assembly
photonic packaging
additive laser manufacturing
multi-photon lithography
facet-attached microlenses
optical alignment tolerances
fiber-chip coupling
hybrid multi-chip modules
Online Access:https://www.light-am.com/article/doi/10.37188/lam.2023.003

Internet

https://www.light-am.com/article/doi/10.37188/lam.2023.003

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