Simulation and experimental study of single-crystal silicon laser assisted cutting based on SPH method
Fine cracks are easy to occur in the processing of monocrystalline silicon, which affects the surface processing quality. Laser assisted machining (LAM) can soften the substitute machining area, effectively reduce the cutting force, extend the tool life and improve the surface quality. In this paper...
Main Authors: | Fenping HUANG, Xiayun SHU, Weijing XU, Xuefeng CHANG |
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Format: | Article |
Language: | zho |
Published: |
Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
2023-12-01
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Series: | Jin'gangshi yu moliao moju gongcheng |
Subjects: | |
Online Access: | http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2023.0025 |
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