Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices
Heat generation is a major issue in all electronics, as heat reduces product life, reliability, and performance, especially in flexible electronics with low thermal-conductivity polymeric substrates. In this sense, the active heat dissipation design with flow channels holds great promise. Here, a th...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-09-01
|
| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/12/10/1165 |