Growth kinetics and IMCs layer analysis of SAC305 solder with the reinforcement of SiC during the isothermal aging condition
The Sn–3.0wt.%Ag–0.5wt.%Cu(SAC305) - xSiC composite solder was prepared by powder metallurgy method with the addition of SiC ceramic reinforcement with various compositions (0, 0.5, 1, and 1.5wt.%). The IMC layer thickness of Cu3Sn and Cu6Sn5 was suppressed during 100 h aging and the minimum thickne...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423010608 |