Modeling and Performance Analysis of a Pump-Driven Chip-Level Two-Phase Cooling System in Data Centers

As a powerful solution for heat dissipation in data centers, chip-level cooling continues to capture escalating attention in research and application domains. To accurately analyze system performance, identify potential avenues for system optimization, and inform future practical applications, we de...

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Bibliographic Details
Main Authors: Leixin Wang, Hao Cheng, Tongzhi Yang, Weixing Yuan, Kexian Ren
Format: Article
Language:English
Published: MDPI AG 2023-06-01
Series:Applied Sciences
Subjects:
Online Access:https://www.mdpi.com/2076-3417/13/13/7472