Modeling and Performance Analysis of a Pump-Driven Chip-Level Two-Phase Cooling System in Data Centers
As a powerful solution for heat dissipation in data centers, chip-level cooling continues to capture escalating attention in research and application domains. To accurately analyze system performance, identify potential avenues for system optimization, and inform future practical applications, we de...
Main Authors: | Leixin Wang, Hao Cheng, Tongzhi Yang, Weixing Yuan, Kexian Ren |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-06-01
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Series: | Applied Sciences |
Subjects: | |
Online Access: | https://www.mdpi.com/2076-3417/13/13/7472 |
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