Pool boiling performance of TiO2 superhydrophilic and Teflon superhydrophobic surfaces on evenly deposited copper frustums
The miniaturization of electronic devices with ever-increasing functionalities inevitably results in greater thermal load on the devices. Hence, pool boiling, which utilizes the powerful latent heat of vaporization, is introduced as an effective method to manage severe thermal loads on miniaturized...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-01-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X22008188 |