Research on Crystal Structure Evolution and Failure Mechanism during TSV-Metal Line Electromigration Process

Research on Crystal Structure Evolution and Failure Mechanism during TSV-Metal Line Electromigration Process

The combined use of Through Silicon Via (TSV) and metal lines, referred to as TSV-metal lines, is an essential structure in three-dimensional integrated circuits. In-depth research into the electromigration failure mechanism of TSV and the microstructure evolution can serve as theoretical guidance f...

Full description

Bibliographic Details
Main Authors: Tao Gong, Liangliang Xie, Si Chen, Xiangjun Lu, Mingrui Zhao, Jianyuan Zhu, Xiaofeng Yang, Zhizhe Wang
Format: Article
Language:English
Published: MDPI AG 2023-12-01
Series:Crystals
Subjects:
TSV
electromigration
electron backscattered diffraction
failure mechanisms
Online Access:https://www.mdpi.com/2073-4352/14/1/37

Internet

https://www.mdpi.com/2073-4352/14/1/37

Similar Items