Sensitivity to Geometric Detail in Fatigue Simulation of Electronic Components of Vehicles
Solder joints strongly determine the lifetime of electronic components subjected to temperature fluctuations. The lifetime predictions obtained by finite element analysis (FEA) are uncertain due to the significant variation in solder geometry. It is unclear how realistic a geometric model is needed...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-11-01
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| Series: | Engineering Proceedings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-4591/79/1/84 |