Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

The evolution of internal compressive stress from the intermetallic compound (IMC) Cu<sub>6</sub>Sn<sub>5</sub> growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05N...

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Bibliographic Details
Main Authors: Aimi Noorliyana Hashim, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Muhammad Mahyiddin Ramli, Khor Chu Yee, Noor Zaimah Mohd Mokhtar, Jitrin Chaiprapa
Format: Article
Language:English
Published: MDPI AG 2021-02-01
Series:Materials
Subjects:
Sn whisker
reliability
lead-free solder
Sn-0.7Cu-0.05Ni
whisker growth
mitigation
Online Access:https://www.mdpi.com/1996-1944/14/4/738

Internet

https://www.mdpi.com/1996-1944/14/4/738

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