A Study of Advancing Ultralow-Power 3D Integrated Circuits with TEI-LP Technology and AI-Enhanced PID Autotuning
The 3D integrated circuit (3D-IC) is garnering significant attention from academia and industry as a key technology leading the post-Moore era, offering new levels of efficiency, power, performance, and form-factor advantages to the semiconductor industry. However, thermal management in 3D-ICs prese...
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| 格式: | 文件 |
| 语言: | English |
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MDPI AG
2024-02-01
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| 丛编: | Mathematics |
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| 在线阅读: | https://www.mdpi.com/2227-7390/12/4/543 |