Wafer Center Alignment System of Transfer Robot Based on Reduced Number of Sensors
This brief presents a wafer alignment algorithm with reduced sensor number that obtains the relative distance of the wafer center and the robot hand. By ‘reduced number’, in spite of smaller number of sensors than the conventional method, we mean an improved method which achieves the similar results...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-11-01
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| Series: | Sensors |
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| Online Access: | https://www.mdpi.com/1424-8220/22/21/8521 |