Microstructure Influence of SACX0307-TiO<sub>2</sub> Composite Solder Joints on Thermal Properties of Power LED Assemblies
The effect of the microstructure of solder joints on the thermal properties of power LEDs is investigated. Solder joints were prepared with different solder pastes, namely 99Sn0.3Ag0.7Cu (as reference solder) and reinforced 99Sn0.3Ag0.7Cu–TiO<sub>2</sub> (composite solder). TiO<sub>...
Main Authors: | , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2020-03-01
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Series: | Materials |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1944/13/7/1563 |