Atomic insights of Cu nanoparticles melting and sintering behavior in CuCu direct bonding

Atomic insights of Cu nanoparticles melting and sintering behavior in CuCu direct bonding

With a layer of Cu nanoparticle slurry, it's promising to achieve fast CuCu direct bonding at low temperature. To have a deeper insight and better control of the process, we apply molecular dynamics method to simulate the melting and sintering behavior of Cu nanoparticles during the direct bon...

Full description

Bibliographic Details
Main Authors: Rui Wu, Xiuchen Zhao, Yingxia Liu
Format: Article
Language:English
Published: Elsevier 2021-01-01
Series:Materials & Design
Subjects:
Cucu direct bonding
Cu nanoparticles
Molecular dynamics
Phase transformation
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127520307759

Internet

http://www.sciencedirect.com/science/article/pii/S0264127520307759

Similar Items