Fabrication Process and Performance Analysis of CSP LED Filaments with a Stacked Package Design
This article presents a chip-scale package (CSP) based filament light-emitting diodes (LEDs) with a stacked-type structure and a segmented-type luminescence design for higher luminous efficiency and better electrical stability. The innovation strategy improves the luminous efficiency by 7.69% and 18...
| Główni autorzy: | , , , , , , , , , |
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| Format: | Artykuł |
| Język: | English |
| Wydane: |
MDPI AG
2018-10-01
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| Seria: | Applied Sciences |
| Hasła przedmiotowe: | |
| Dostęp online: | http://www.mdpi.com/2076-3417/8/10/1940 |