Grain boundary passivation via balancing feedback of hole barrier modulation in HfO2-x for nanoscale flexible electronics
Abstract Flexible electronics has attracted considerable attention owing to its enormous potential for practical applications in various fields. However, the massive strain produced during bending degrades the device. Especially at grain boundaries, due to the accumulation of defects, this degradati...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2022-09-01
|
| Series: | Nano Convergence |
| Subjects: | |
| Online Access: | https://doi.org/10.1186/s40580-022-00336-4 |