A Study of Electroplated Nanoporous Copper Using Aberration-Corrected Transmission Electron Microscopy
Nanoporous Cu foam is widely applied in many fields such as the packaging of electronic power devices. In this study, a sandwich-structured Cu-Zn eutectic alloy precursor composed of Cu<sub>0.53</sub>Zn<sub>0.47</sub>/Cu<sub>5</sub>Zn<sub>8</sub>/Cu<...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-03-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/14/6/487 |